183° Solder Paste Syringe Flux for Soldering SMD BGA IC PCB Needle Tube Tin Solder Paste, Pusher/needle feed, Silver-containing medium temperature tin paste

The 183° Solder Paste Syringe Flux is a silver-containing medium-temperature tin paste designed for soldering SMD (Surface Mount Devices), BGA (Ball Grid Array), IC (Integrated Circuit), and PCB (Printed Circuit Board). With a melting point of 183°C, it offers excellent conductivity and strong solder joints. The solder paste is packaged in a syringe with a needle for precise application and supports both pusher and needle feed, making it ideal for high-precision soldering in electronics production and repair tasks.

Applications

• Soldering of surface-mount devices (SMD)
• BGA chip soldering and repair
• IC and PCB connections
• Medium temperature soldering with silver for enhanced conductivity
• Ideal for precision electronics soldering in production or repair environments