217° Solder Paste Syringe Flux for Soldering SMD BGA IC PCB Needle Tube Tin Solder Paste, Pusher/needle feed, Lead-free high temperature solder paste

The 217° Solder Paste Syringe Flux is a lead-free high-temperature solder paste designed for soldering SMD (Surface Mount Devices), BGA (Ball Grid Array), IC (Integrated Circuit), and PCB (Printed Circuit Board). With a high melting point of 217°C, it is ideal for soldering applications that require strong and durable joints. The solder paste is packaged in a syringe with a needle, allowing for precise application. It supports both pusher and needle feed, making it suitable for use in electronics production and repair, especially where high-temperature soldering is required.

Applications

• Soldering of surface-mount devices (SMD)
• BGA chip soldering and repair
• IC and PCB connections
• High-temperature soldering for strong and durable joints
• Ideal for electronics manufacturing and repair tasks that require precise soldering at elevated temperatures