Seeed Studio XIAO ESP32C3 RISC-V MCU WIFI Dev Board
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Seeed Studio XIAO ESP32C3 RISC-V MCU WIFI Dev Board
Flexible MCU Board: Incorporate the ESP32-C3 32-bit RISC-V chip, operating up to 160 MHz, mounted multiple development ports, supported by Arduino / CircuitPython
Outstanding RF performance: Implement complete Wi-Fi functions and Bluetooth Low Energy, while supporting communication over 100m with a U.FL antenna
Elaborate Power Design: Provide 4 working modes as low as 44 μA in deep sleep mode, while supporting lithium battery charge management
Thumb-sized Design: 21 x 17.5mm, Seeed Studio XIAO series classic form factor and elegant productization of single-sided components mounting, suitable for wearable devices
Perfect for Production: Breadboard-friendly & SMD design, no components on the back
Specification
|
Parameter |
Description |
|
Processor |
ESP32-C3 SoC |
|
RISC-V single-core 32-bit chip processor with a four-stage pipeline that operates at up to 160 MHz |
|
|
Wireless |
Complete 2.4GHz Wi-Fi subsystem |
|
Bluetooth 5.0/ Bluetooth mesh |
|
|
On-chip Memory |
400KB SRAM & 4MB Flash |
|
Interface |
1x UART, 1x IIC, 1x SPI,11x GPIO(PWM), 4x ADC |
|
1x Reset button, 1x Boot button |
|
|
Dimensions |
21 x 17.5mm |
|
Power |
Circuit operating voltage: 3.3V@200mA |
|
Charging current: 350mA/100mA |
|
|
Input voltage (VIN): 5V |
|
|
Deep Sleep Power Consumption |
Deep Sleep Model: >44 μA |
|
Wi-Fi Enabled Power Consumption |
Active Model: <75 mA |
|
Modem-sleep Model: <25 mA |
|
|
Light-sleep Model: <4 mA |
|
|
BLE Enabled Power Consumption |
Modem-sleep Model: <27 mA |
|
Light-sleep Model: <10 mA |
|
|
Working Temperature |
-40°C ~ 85°C |
Hardware Overview
Pinout
Application
- Internet of Things
- Wearable devices
- Health monitoring
- Education
- Low-Power(LP) networking
- Rapid prototyping
Documents
Note
XIAO SoM User Manual open-sources all hardware and software materials of XIAO, providing professional product design guidelines to help you accelerate ideas off the ground, streamline product design, providing a seamless experience from module selection to mass production. You can check here to see more info.
Effective Date: March 27, 2025
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