The 183° Solder Paste Syringe Flux is a silver-containing medium-temperature tin paste designed for soldering SMD (Surface Mount Devices), BGA (Ball Grid Array), IC (Integrated Circuit), and PCB (Printed Circuit Board). With a melting point of 183°C, it offers excellent conductivity and strong solder joints. The solder paste is packaged in a syringe with a needle for precise application and supports both pusher and needle feed, making it ideal for high-precision soldering in electronics production and repair tasks.
Applications
- Soldering of surface-mount devices (SMD)
- BGA chip soldering and repair
- IC and PCB connections
- Medium temperature soldering with silver for enhanced conductivity
- Ideal for precision electronics soldering in production or repair environments