The 183° Solder Paste Syringe Flux is designed for soldering SMD (Surface Mount Devices), BGA (Ball Grid Array), IC (Integrated Circuit), and PCB (Printed Circuit Board). It is a medium temperature solder paste that contains lead, with a melting point of 183°C. The solder paste comes in a syringe with a needle for precise application and is suitable for both pusher and needle feed. This type of solder paste is ideal for electronics that require reliable and strong solder joints.
Applications:
- Soldering of surface-mount devices (SMD)
- BGA chip soldering and repair
- IC and PCB connections
- Medium temperature soldering for durable and strong joints
- Ideal for precise electronics soldering tasks in production or repair